According to industry sources, TSMC is planning to introduce a 12 nanometer half-node process to enhance competition with 28nm and lower process nodes that have been adopted over the past few years.

Rohm will integrate its own development and manufacturing technologies for GaN power devices with the process technology of TSMC. By licensing TSMC GaN technology, Rohm says it will strengthen its ...

Rohm has decided to combine its own development and manufacturing technologies for GaN power devices with TSMC’s process ...

ROHM Co., Ltd. (hereinafter "ROHM") has decided to integrate its own development and manufacturing technologies for GaN power devices with the process technology of TSMC, with which ROHM has an ...

Accelerates Pathway to Ultra High-Speed 1.6Tbps Bandwidth for Build Out of the Next Generation of Cloud Computing, AI, and Hyperscale Networks SAN JOSE, Calif.--(BUSINESS WIRE)-- Credo Technology ...

AMBIQ MICROAtomiq SoC is built on firm’s 12nm SPOT platform using the TSMC N12e process, introducing a new Ultra-Low-Power (ULP) mode engineered to operate as ...

Ansys secured an award in the category of Joint Development of 2nm and N3P Design Infrastructure for delivering foundry-certified, state-of-the-art power integrity and reliability signoff verification ...

Both Taiwan Semiconductor (NASDAQ:TSM) and Advanced Micro Devices (NASDAQ:AMD) have been great long-term picks for investors. That’s a fact most investors are well aware of. That said, these companies ...

The move builds on ROHM’s longstanding partnership with TSMC, through which the companies have already established an ...

Taiwan Semiconductor Manufacturing Co. is advancing plans for a new fabrication plant at the Tainan Science Park, targeting ...

A new report suggests TSMC’s 2nm process may bring smaller-than-expected gains in power, performance, and area despite its next-gen branding. If true, the reduced complexity could keep wafer pricing ...

The Intel 18A process is in production and features a critical technology currently exclusive to Intel. Backside power delivery moves power circuits to the back of the chip, unlocking additional ...